Power & Protection Fuses (Chip Inch, Chip Metric, Holders, PTC Resettable) Opto Emitters LED (SMD, THT, Bi-Color, RGB, RGBW, Infrared, Ultraviolet)
Sensors (Axial, Chip, Chip Corner Concave, DFN, DIP, Molded (PLCC-2), Radial Round, Radial Rectangular, SOD, SODFL, SOT, TO Cylindrical, Others) LED (Axial, Chip, Chip Corner Concave, Chip Side Concave (2,4,6 Pins), Molded (PLCC-2), Radial Round (3mm, 4mm, 5mm, 8mm, 10mm), Radial Rectangular, Radial Oval, Radial Cylindrical, SOD, SODFL, DFN, SOL (PLCC-4, PLCC-6, PLCC-8), TO Cylindrical) Submenu for creating pattern internal pad-to-pad connection (avoid accidental creation).Ĭon TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm) ĭPAK (Pitch 1.27mm, 2.28mm, 2.29mm, 2.30mm) ĭiodes (Axial, DFN 2 Pins, DFN 3 Pins, MELF, Molded, SOD, SOFL) įuses (Chip Inch, Chip Metric, Holders, Radial Dipped Rectangular, Radial Disk) Display/Find vias by style on the layout. Side and isometric view buttons in 3D preview dialogs. Edge rail width for V-score panelizing of a rectangular board does not include the "Board to Edge/ Board to Board" gap. Group is aligned as a single object in the Align Objects feature. Radial / Polar Placement of design objects in PCB Layout and Pattern Editor. Continue routing option in net merge/move pad submenu. Pause routing (allows editing other traces/vias and resuming routing in one key press). Ability to make a portable version of the program ( ). Environment Variables in all paths, support of related project/program paths for libraries/models/pictures. New XML format for component and pattern libraries. The list of new features (radial placement and alignment of the groups have been added if compare to 4.2 beta): We have published stable version 4.2 today.
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